Senior Firmware Engineer / FitnessTech

A rapidly growing consumer hardware and AI company is seeking a Senior Firmware Engineer, Connectivity, to join their full-time engineering team. This role can be based in the United States and focuses on building next-generation connected devices that blend embedded systems, cloud technology, and machine learning. The ideal candidate will bring deep expertise in Bluetooth Low Energy (BLE), embedded development in C/C++, and wireless device architecture while helping scale a globally deployed product platform.

This is a unique opportunity to become the primary technical owner of wireless connectivity for a category-defining consumer product. The engineer joining this team will influence architecture decisions, firmware update strategy, power optimization efforts, manufacturing validation, and customer-facing reliability initiatives. Candidates who enjoy solving difficult challenges across firmware, RF, hardware, and mobile environments will find significant growth opportunities and ownership in this position.

Required Skills & Experience 5+ years of embedded software or firmware engineering experience

3+ years building and shipping BLE-enabled products

Strong understanding of Bluetooth protocols including GAP, GATT, L2CAP, SMP, and BLE security

Expertise with C and/or C++ development on microcontrollers

Experience with embedded peripherals including UART, SPI, I2C, and DMA

Hands-on debugging experience using oscilloscopes, logic analyzers, and protocol sniffers

Experience deploying OTA firmware updates in production environments

Knowledge of low-power device optimization techniques

Desired Skills & Experience Nordic Semiconductor platform experience

Zephyr or nRF Connect SDK experience

Consumer electronics or IoT product experience

Secure boot and embedded security knowledge

Regulatory certification experience (FCC, CE, Bluetooth SIG)

Manufacturing support experience

Python or Node.js tooling experience

Multi-device BLE architecture expertise

What You Will Be Doing

Tech Breakdown 70% Embedded Firmware Development

20% Wireless Connectivity & RF Optimization

10% Automation, Tooling & Testing

Daily Responsibilities 80% Hands-On Engineering

5% Leadership & Mentorship

15% Cross-Functional Collaboration

The Offer Bonus eligible

You will receive the following benefits: Medical, Dental, and Vision Insurance

Vacation Time

Stock Options

Applicants must be currently authorized to work in the US on a full-time basis now and in the future.

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