Package Design Engineer

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Desired Candidate Profile

BS or MS in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or a related discipline. 0 2 years of experience in semiconductor package design, PCB design, or related work (internships, co-ops, and academic projects considered). Foundational understanding of semiconductor packaging concepts such as FCBGA/FCCSP, organic substrates, interposers, and flip-chip assembly. Basic knowledge of high-speed signaling concepts, including transmission lines, controlled impedance, and differential pairs. Exposure to EDA, package/PCB layout, or simulation tools. Familiarity with data analysis or scripting tools such as Python or MATLAB is a plus. Strong analytical, problem-solving, and organizational skills, with attention to detail. Good communication skills and eagerness to learn in a collaborative, cross-functional environment. Self-motivated, adaptable, and able to take direction while growing technical independence.